FILL BOND PUTTY

3 285
Описание

Fill Bond aerospace putty from Sherwin-Williams Aerospace Coatings has been created specifically for aerospace use. Designed to fill rivets, seams and small spot-repair areas on the exterior of aircraft fuselage and wings, this high-build body filler is now available in a convenient epoxy version.

Fill Bond putty is extremely flexible, offers direct-to-metal adhesion (with properly pre-treated aluminum), provides excellent spread ability and offers a long, workable pot life to give users the amount of time to apply material on a variety of aircraft surfaces, including aluminum and composites.

The epoxy putty dries quickly for a fast sand - in just two to six hours compared to between six and eight hours with competitive products. Additionally, Fill Bond putty is free of chrome and lead hazards.

    The epoxy putty is dispensed through a manual, twin-tube cartridge dispensing gun

    A specially-designed Fill Bond dispensing gun enables users to apply putty exactly where it is needed without requiring additional tools. An , there's minimal waste following application. Users apply only as much product as they need and then can put the cap back on the convenient cartridge containers for later user, saving on material and disposal costs.

    Download the Product Data
    (PDF)
Features
  • Extremely flexible for lasting durability
  • Minimal waste means lower cost
  • Sand in 2-6 hours for higher productivity
  • Great spreadability for smoother application
  • Long, workable pot life for production efficiency
  • High film build tolerance means fewer problems
  • High sag resistance means less sanding
Арт. MPN Описание Цена Add to cart form
01-01125
EP007S
FILL BOND CARTRIDGE 375ML
$ 118.75
01-01124
EP007
FILL BOND PUTTY
$ 147.75
01-01128
1432053
FILL BOND STATIC MIXER ELEMENT
$ 10.95
01-01127
1426824
FILL BOND MANL DISP GUN 750ML
$ 256.95
01-01126
8689556
FILL BOND MANL DISP GUN 370ML
$ 194.75

Отзывы Оставить отзыв

Отзывы ещё не добавлены

Вопросы и ответы
Вопросы отсутствуют.